Expansion Board 4 Channel Relay Board Module Power Relay Module OEM manufacturer PCBA Raspberry Pi pictures & photos

Expansion Board 4 Channel Relay Board Module Power Relay Module OEM manufacturer PCBA Raspberry Pi

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series,...
Material for PCB Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCBA Manufacturing Comparison

	Expansion Board 4 Channel Relay Board Module Power Relay Module OEM manufacturer PCBA Raspberry Pi Contact Now	Quick View 2/4/6/8/10/12 Layer Double-Sided PCB Laptop Motherboard PCB Fabricado En Manufacturing Circuit-Board Supplier OEM Motherboard with Arduino Uno PCB Contact Now	Quick View UL 94V 0 Arcade Game Pressure Transmitter Android Car Stereo Induction Cooker UPS PCB Boards Contact Now	Quick View PCB Circuit Board Printed Electronics Assembly Manufacture Production PCB Contact Now	Quick View Manufacturer Fr4 Material Electronic Bare PCB Printed Circuit Board Contact Now

Transaction Info
	Expansion Board 4 Channel Relay Board Module Power Relay Module OEM manufacturer PCBA Raspberry Pi Contact Now	Quick View 2/4/6/8/10/12 Layer Double-Sided PCB Laptop Motherboard PCB Fabricado En Manufacturing Circuit-Board Supplier OEM Motherboard with Arduino Uno PCB Contact Now	Quick View UL 94V 0 Arcade Game Pressure Transmitter Android Car Stereo Induction Cooker UPS PCB Boards Contact Now	Quick View PCB Circuit Board Printed Electronics Assembly Manufacture Production PCB Contact Now	Quick View Manufacturer Fr4 Material Electronic Bare PCB Printed Circuit Board Contact Now
Price	US$0.03-10.00 / Piece	US$0.01-0.08 / Piece	US$0.01-0.08 / Piece	US$0.01-0.08 / Piece	US$0.01 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	-	-	-	-	ISO/CQC/IATF/UL/RoHS
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	East Asia(Japan/ South Korea), Domestic	East Asia(Japan/ South Korea), Domestic	East Asia(Japan/ South Korea), Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Unice or OEM; Layer: 1 to 20; Mini Board Size: 88mm;* Max Board Size: 650610mm;* Board Thickness: 0.3mm~3.5mm; Finished Inner Copper Thickness: H/H0z-4/40z; Finished Outer Copper Thickness: H/H0z-5/50z; Min Hole Size: 0.2mm; Surface Finishing: OSP,Immersion Gold,Gold Plating,Enig,Enepig; Warranty: 1 Year;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Jian Unice Pcb Technique Co., Ltd
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