| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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Type: Combining Rigid Circuit Board;
Dielectric: Non-Woven Fiberglass/PTFE Composites (Rogers Isocl;
Material: Rogers Isoclad 917;
Application: Conformal Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Isoclad 917 (Fiberglass/PTFE);
Insulation Materials: Isoclad 917 (Serving as The Dielectric Material);
Brand: Rogers;
Test Method: Ipc TM-650;
Board Types: Rigid PCB;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Automotive Radar and Sensors;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Brand: Rogers;
Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Line/ Space: 0.075mm;
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Type: Rigid Circuit Board;
Dielectric: Woven Fiberglass/PTFE Composites (Rogers Diclad 87;
Material: Rogers Diclad 870;
Application: Commercial Phased Array Networks;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: OSP;
Base Material: Woven Fiberglass Reinforced PTFE (Diclad 870);
Insulation Materials: Diclad 870 (Serving as The Dielectric Material);
Brand: Rogers;
Solder Mask: Green, Black, Blue, Red, Yellow etc.;
Surface Finish: Vimmersion Gold, HASL, Immersion Silver, Immersion;
Designation: Diclad 870;
Copper Weight: 1oz (35µm), 2oz (70µm);
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