PCBA Manufacturing

US$0.03-10.00 / Piece

Electronic Load Test Resistor Module 25W Ld25 USB Type C Interface Discharge Adjustable Constant Current 0.25A-4A Temperature Control Cool USB USB Load Tester pictures & photos

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What is Electronic Load Test Resistor Module 25W Ld25 USB Type C Interface Discharge Adjustable Constant Current 0.25A-4A Temperature Control Cool USB USB Load Tester

Name: Electronic Load Test Resistor Module 25W Ld25 USB Type C Interface Discharge Adjustable Constant Current 0.25A-4A Temperature Control Cool USB USB Load Tester
Uploaded: 2025-12-21T18:13:29+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series,...
Material for PCB Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

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	Electronic Load Test Resistor Module 25W Ld25 USB Type C Interface Discharge Adjustable Constant Current 0.25A-4A Temperature Control Cool USB USB Load Tester Contact Now	Smart Electronics 220V Driverless Dob Light Source Board Circular SMD High-Brightness Aluminum Substrate LED Light Board Contact Now	Smart Electronics LED Light Board 220V Driverless Dob Light Source Board Circular SMD High-Brightness Light Core Aluminum Substrate Custom PCB Board Contact Now	Smart Electronics LED Light Board 220V Driverless Dob Light Source Board Circular LED Aluminum Substrate Contact Now	Smart Electronics Customized LED Aluminum Substrates PCB Circuit Boards Rapid Prototype Light Strips PCB Contact Now

Transaction Info
	Electronic Load Test Resistor Module 25W Ld25 USB Type C Interface Discharge Adjustable Constant Current 0.25A-4A Temperature Control Cool USB USB Load Tester Contact Now	Smart Electronics 220V Driverless Dob Light Source Board Circular SMD High-Brightness Aluminum Substrate LED Light Board Contact Now	Smart Electronics LED Light Board 220V Driverless Dob Light Source Board Circular SMD High-Brightness Light Core Aluminum Substrate Custom PCB Board Contact Now	Smart Electronics LED Light Board 220V Driverless Dob Light Source Board Circular LED Aluminum Substrate Contact Now	Smart Electronics Customized LED Aluminum Substrates PCB Circuit Boards Rapid Prototype Light Strips PCB Contact Now
Price	US$0.03-10.00 / Piece	US$0.10-1.90 / Piece	US$0.10-1.90 / Piece	US$0.10-1.90 / Piece	US$0.10-1.90 / Piece
Min Order	1 Piece	5 Pieces	5 Pieces	5 Pieces	5 Pieces
Payment Terms	T/T, PayPal, Western Union	T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: OEM; Copper Thickness: 0.5oz-6oz; Min. Hole Size: 0.1mm; Min.Line Width: 0.075mm; Min. Line Spacing: 0.075mm; Functional Application: Industrial Control/Consumer Electronics/Other; Board Thickness: 0.8mm~3.0mm; Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating; Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing; Number of Layers: 1-6 Layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: OEM; Copper Thickness: 0.5oz-6oz; Min. Hole Size: 0.1mm; Min.Line Width: 0.075mm; Min. Line Spacing: 0.075mm; Functional Application: Industrial Control/Consumer Electronics/Other; Board Thickness: 0.8mm~3.0mm; Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating; Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing; Number of Layers: 1-6 Layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: OEM; Copper Thickness: 0.5oz-6oz; Min. Hole Size: 0.1mm; Min.Line Width: 0.075mm; Min. Line Spacing: 0.075mm; Functional Application: Industrial Control/Consumer Electronics/Other; Board Thickness: 0.8mm~3.0mm; Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating; Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing; Number of Layers: 1-6 Layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: OEM; Copper Thickness: 0.5oz-6oz; Min. Hole Size: 0.1mm; Min.Line Width: 0.075mm; Min. Line Spacing: 0.075mm; Functional Application: Industrial Control/Consumer Electronics/Other; Board Thickness: 0.8mm~3.0mm; Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating; Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing; Number of Layers: 1-6 Layers;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Smart Electronics Co., Ltd	Shenzhen Smart Electronics Co., Ltd	Shenzhen Smart Electronics Co., Ltd	Shenzhen Smart Electronics Co., Ltd
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