20W+20W Class D Digital Power Amplifier Board 12V-24V Mini Power Amplifier Module pictures & photos

20W+20W Class D Digital Power Amplifier Board 12V-24V Mini Power Amplifier Module

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About this Item

Price

Min. Order Reference FOB Price

2 Pieces US$2.00-4.50 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Vacuum Packaging, Carton Box
Specification FR-4 SILICON COMPONENTS
Trademark New Chip
Origin China
Layer 1-32 Layers
Service OEM/ODM
OEM/ODM Available
Test 100%E-Testing
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea
Surface Treatmen OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes

Product Description

Product Description What we offer: Products Application: Communication, internet, industrial control, computer application, consumptive electronics, spaceflight, curative application Etc. Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCB Comparison

	20W+20W Class D Digital Power Amplifier Board 12V-24V Mini Power Amplifier Module Contact Now	UL & RoHS Certificate Double Side Pcbs Made in China Contact Now	Quick View Snap off Hole Quick Turn Prototype PCB Fabrication Multilayer Enig & HASL PCB Circuit Board with Good Quality Multilayer HDI Quick Term Printed Circuit Board Contact Now	Quick View OEM Design Blue Solder Mask PCB Production Contact Now	Quick View HASL&Immersion Tin PCB Circuit Board Shenzhen Factory Price Multilayer Printed Circuit Board Blind and Buried Holes Immersion Gold, HDI PCB Circuit Board Contact Now

Transaction Info
	20W+20W Class D Digital Power Amplifier Board 12V-24V Mini Power Amplifier Module Contact Now	UL & RoHS Certificate Double Side Pcbs Made in China Contact Now	Quick View Snap off Hole Quick Turn Prototype PCB Fabrication Multilayer Enig & HASL PCB Circuit Board with Good Quality Multilayer HDI Quick Term Printed Circuit Board Contact Now	Quick View OEM Design Blue Solder Mask PCB Production Contact Now	Quick View HASL&Immersion Tin PCB Circuit Board Shenzhen Factory Price Multilayer Printed Circuit Board Blind and Buried Holes Immersion Gold, HDI PCB Circuit Board Contact Now
Price	US$2.00-4.50 / Piece	US$60.00-75.00 / Square Meter	US$0.10-80.00 / Piece	US$0.10-80.00 / Piece	US$0.10-80.00 / Piece
Min Order	2 Pieces	5 Square Meters	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	LC, T/T	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	-	UL,ISO9001&ISO14001,SGS,RoHS Report	UL, ISO9001&ISO14001, SGS, RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	Own Brand, ODM, OEM	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr-4; Insulation Materials: Organic Resin; Brand: Kb; Surface: OSP,Immersion Gold,Hal Lead Free,Hal; Solder Mask: Green,Red,Yellow,White,Black,Blue,etc; Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS); Sample Date: 3-5 Days; MOQ: 10PCS; Delivery Time: 15 Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;
Supplier Name	Shenzhen New Chip international Ltd	Zhejiang Dejia Electronics Technology Co.,Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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