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      High Quality PCBA Manufacturer Function Custom Circuit Board

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-10.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy Resin + Polyimide Resin
      • Application Consumer Electronics
      • Flame Retardant Properties V2
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand New Chip
      • Transport Package Foam Packing
      • Specification FR4 1-4 Layers
      • Trademark New Chip
      • Origin China
      • Capacity 1000000
      • OEM/ODM Available
      • Sample Available
      • Surface Treatment OSP, Enig, HASL, AG Immersion
      • Certificate Gurantee Yes
      • Test 100%E-Testing
      • Min Bonding Pad Diameter 10mil
      • Min Thickness of Soldermask 10um
      • Color of Silk-Screen White, Yellow, Black
      • Data File Format Gerber File and Drilling File, Protel Series, ...
      • Material for PCB Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari
      • Layer Count 1-20 Layers
      • Shipping DHL/UPS/FedEx/Air/Sea

      Product Description

      Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. Board ...

      Learn More

      PCBA Manufacturing Comparison
      Transaction Info
      Price US$1.00-10.00 / Piece US$1.00-5.00 / pieces US$0.22-2.99 / pieces US$0.50-8.00 / pieces US$0.50-5.00 / pieces
      Min Order 1 Piece 5 pieces 10 pieces 5 pieces 5 pieces
      Payment Terms T/T, PayPal, Western Union T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification - - RoHS, Is09001:2000, CE RoHS,Is09001:2000 RoHS,Is09001:2000
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4,Tg,Cem-1,Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Modelnumber: 4oz Gold Finger PCB Board;
      Selling Units: Single Item;
      Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
      Number of Layers: 2/4/6/8/12/Custom;
      Copper Thickness: 0.5-6.0oz;
      Min Trace/Gap: 0.075mm or 3mil;
      Board Size: Custom;
      PCB Cutting: Shear V-Score,Tab-Routed;
      Board Thickness: 0.2-4.0mm;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Number of Layers: 2/4/6/8/12/14or Custom;
      Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
      Copper Thickness: 0.5-6.0oz;
      Min. Hole Size: 0.1mm;
      Hole Spacing: 2.54mm;
      Min.Line Width: 0.15mm;
      Board Thickness: 0.2-4.0mm;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4,Tg,Cem-1,Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Number of Layers: 2/4/6/12/14or Custom;
      Copper Thickness: 0.5-6.0oz;
      Min.Hole Size: 0.1mm;
      Min. Line Width: 0.15mm;
      Board Size: Custom;
      Board Thickness: 0.2-4.0mm;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4,Tg,Cem-1,Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Selling Units: Single Item;
      Number of Layers: 2/4/6/8/12/14or Custom;
      Shape: Rectangular,Round,Slots,Cutouts,Complex Irramular;
      Copper Thickness: 0.5-6.0oz;
      Min.Hole Size: 0.1mm;
      Board Size: Custom;
      Min.Line Width: 0.15mm;
      Board Thickness: 0.2-4.0mm;
      Supplier Name

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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