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US$1.00-10.00 / Piece

PCBA Custom Assembly Supplier Immersion Gold Board PCBA Assembly Board From Shenzhen pictures & photos

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What is PCBA Custom Assembly Supplier Immersion Gold Board PCBA Assembly Board From Shenzhen

Name: PCBA Custom Assembly Supplier Immersion Gold Board PCBA Assembly Board From Shenzhen
Uploaded: 2025-12-22T07:18:42+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093",

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Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series, ...
Material for PCB Fr-4, Halogen Free, Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. Board ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCBA Manufacturing Comparison

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Transaction Info
	PCBA Custom Assembly Supplier Immersion Gold Board PCBA Assembly Board From Shenzhen Contact Now	Thermal Conductive Metal Core PCB for LED - Professional PCBA Solution for All Types of High Power Lamps Contact Now	Total PCBA Solution for High Power LED Lights - Professional Manufacturer for Street Light Plant Light with Excellent Heat Dissipation Contact Now	Thermal Conductive PCB for LED Lighting - Customized PCBA Service for Flood Light High Bay Light Quick Turn Available Contact Now	Quality Control LED Lighting PCBA - Thermal Management Aluminum Board Factory with Fast Delivery Contact Now
Price	US$1.00-10.00 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;
Supplier Name	Shenzhen New Chip international Ltd	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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