Jetson Nano Developer Kit Single Board Computer for Ai Development - B01 Version Manufacturing PCBA OEM pictures & photos

Jetson Nano Developer Kit Single Board Computer for Ai Development - B01 Version Manufacturing PCBA OEM

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.30

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series,...
Material for PCB Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCBA Manufacturing Comparison

	Jetson Nano Developer Kit Single Board Computer for Ai Development - B01 Version Manufacturing PCBA OEM Contact Now	SMT DIP PCBA Multilayer Manufacturer Contact Now	SMT PCBA Print Circuit Board Manufacturer Contact Now	Industrial PCBA Motherboard Electronic Board SMT PCBA Contact Now	Quick View Copper Foil 94V0/Cem/Fr4 PCB HASL Single Side Printed Circuit Board Contact Now

Transaction Info
	Jetson Nano Developer Kit Single Board Computer for Ai Development - B01 Version Manufacturing PCBA OEM Contact Now	SMT DIP PCBA Multilayer Manufacturer Contact Now	SMT PCBA Print Circuit Board Manufacturer Contact Now	Industrial PCBA Motherboard Electronic Board SMT PCBA Contact Now	Quick View Copper Foil 94V0/Cem/Fr4 PCB HASL Single Side Printed Circuit Board Contact Now
Price	US$0.30-10.00 / Piece	US$0.99-20.00 / Piece	US$8.00-20.00 / Piece	US$0.99-20.00 / Piece	US$0.10-2.20 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	-	-	-	-	ISO/CQC/IATF/UL/RoHS
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: PCBA; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: HB; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Unice; Layer: 1-20; Finished Outer Copper Thickness: H/H0z-5/50z;	Type: PCBA; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: HB; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Unice; Layer: 1-20; Finished Outer Copper Thickness: H/H0z-5/50z;	Type: PCBA; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: HB; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Unice; Layer: 1-20; Finished Outer Copper Thickness: H/H0z-5/50z;	Type: Rigid Circuit Board; Dielectric: FR-4; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Base Material: Copper; Insulation Materials: Epoxy Resin; Product Name: Fr4 Printed Circuit Board; Layer: 1~20; Finished Outer Copper Thickness: H/H0z-5/5oz; Finished Inner Copper Thickness: H/H0z-4/4oz; Min Board Size: 88mm;* Board Thickness: 0.3mm~3.5mm; Max Board Size: 650610mm;* Min Hole Size: 0.2mm; Surface Finish: HASL/HASL Lf/OSP/Immersion Gold/Tin/ Silver; Value-Added Service: Layout;
Supplier Name	Shenzhen New Chip international Ltd	Jian Unice Pcb Technique Co., Ltd	Jian Unice Pcb Technique Co., Ltd	Jian Unice Pcb Technique Co., Ltd	Jian Unice Pcb Technique Co., Ltd
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