| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Mzh;
Board Thickness: 1.0mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm;
Max Copper: 12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min Trace/Space: 3/3 Mil;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Fastest Delivery Time: 24 Hours (Sample);
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Type: Rigid Circuit Board;
Dielectric: Tly-5;
Material: Woven Fiberglass Reinforcement;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Surface Finish: Immersion Gold;
Board Thickness: 0.6mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°c;
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Type: Rigid Circuit Board;
Dielectric: RO3006;
Material: Ceramic-Filled PTFE Composites;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Silver;
Board Thickness: 0.25mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
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Type: Rigid Circuit Board;
Dielectric: Tu-768;
Material: Epoxy Resin System Reinforced with Woven E-Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Tuc;
Surface Finish: Hot Air Soldering Level;
Board Thickness: 1.6mm (Finished);
Layer Count: 2-Layer;
Solder Mask: Green;
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