| Specification |
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: 14;
Base Material: Fr-4 Tg170;
Customized: Customized;
Condition: New;
Board Thickness: 0.2-6.0 mm;
Copper: 0.5-12 Oz;
Min Hole Size: 0.15 mm;
DIP Capacity: 100 Thousand Pins/Day;
Application: Communications, Industrial Control, Semiconductors;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min BGA Ball Pitch: 0.4mm;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Alloy: Lead Free;
Powder Size: Type 3: 25 to 45 Microns;
Powder Size 2: Type 4: 20 to 38 Microns;
Flux: No Clean Flux;
Alloy 2: Sac305 Sn96.5AG3.0cu0.5;
Alloy 3: Sac0307 Sn99AG0.3cu0.7;
Alloy 4: Sn42bi58 Low Temperature;
Packing: Jar;
Packing 2: Syringe;
Shipping: Courier / Air Freight;
Shelf Life: 6months;
Storage: 0 to 10 Degree Celsius;
Application: SMT;
Application 2: SMD;
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Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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