| Specification |
Material: Fr-4(Tg135, Tg150, Tg170, Tg180, Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
PCBA-Testing: Aoi, X-ray, Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Board Thickness: 0.2-6.0mm;
Surface Treating Way: HASL;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|