| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1 PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: HDI PCB Board;
Buried Vias: No;
Blind Vias: No;
Filled Via: No;
Layer: 4;
Surface Finish: Enig;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Thickness: 0.15/0.8/1.0/1.6/2.0/2.4/2.8/3.0/3.2mm;
Inner Copper: 1/2/3/4 Oz;
Finish Copper: 1/2/3/4 Oz;
Surface Finish: Enig/HASL/HASL Lf/OSP;
Solder Mask: Green/White/Red/Orange/Purple;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
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