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      PCB Circuit Board Assembly
      US$10.00 / Piece
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      What is Multilayer Copper PCBA Manufacturer Provide SMT Components PCB Assembly Service

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      5 Pieces US$10.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Mu Star
      • Transport Package Vacuum, Anti-Static, ESD
      • Specification 1120*800mm
      • Trademark Mu Star
      • Origin China
      • Solder Mask Color Green, Red, Black (as Your Require)
      • Silkscreen Color White, Black
      • Testing Service Ict, Function Test, X-ray, Aoi
      • Layers 1-64
      • MOQ 5PCS
      • Warranty 2 Years

      Product Description

      Specification 1 Material CEM-1, CEM-3, FR-4, Aluminum, Rogers, high Tg etc. 2 Board thickness Mass production: 394mil(10mm) Samples: 17.5mm 3 Surface finish HASL, OSP, Immersion Gold/Silver/Tin, ENIG, Gold Finger 4 PCB Max panel size 1150mm × 560mm 5 Layer 1-64 L 6 Min hole size Mechanical drill: ...

      Learn More

      PCB Circuit Board Assembly Comparison
      Transaction Info
      Price US$10.00 / Piece US$0.90-2.60 / Piece US$5.60 / Piece US$52.00 / Piece US$17.00 / Piece
      Min Order 5 Pieces 1 Piece 500 Pieces 500 Pieces 500 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Mu Star;
      Solder Mask Color: Green, Red, Black (as Your Require);
      Silkscreen Color: White, Black;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      Layers: 1-64;
      MOQ: 5PCS;
      Warranty: 2 Years;
      Type: 94V-0 Multilayer PCB;
      Dielectric: FR-4;
      Material: Customized;
      Application: All;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, FPC , Ceramic, Aluminum-Based, High Freque;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing,Flying Probe Tester,Functional;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Weight(Kg): 0.16;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Weight(Kg): 0.09;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Weight(Kg): 0.43;
      Supplier Name

      Mu Star (Shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

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