Custom Turnkey High-Quality PCB Assembly Factory Automotive Electronic Boards PCBA pictures & photos

Custom Turnkey High-Quality PCB Assembly Factory Automotive Electronic Boards PCBA

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.60

100-999 Pieces US$5.20

1,000-9,999 Pieces US$3.98

10,000+ Pieces US$2.68

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Mustar
Transport Package Vacuum, Anti-Static, ESD
Specification 800*1200mm
Origin Guangdong
Copper Thickness 1-12 Oz
Board Thickness 0.8, 1.0, 1.2, 1.6, 2, 2.4mm
Surface Finishing HASL,Immersion Gold,Flash Gold, Plated Silver, OSP
Minimum Line Width Spacing 0.015mm
Minimum Line Spacing 0.015mm
Testing Service Ict, Function Test, X-ray, Aoi
MOQ 1 PCS
Certificate RoHS/ISO9001/Ts16949/ISO14001/ISO13485
Layers 1-64
Warranty 2 Years

Product Description

PCBA Manufacturing Service Electronics Manufacturer Assembly SMT DIP PCB Product Description Our Advantages: 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. Professional service: PCB/FPC/Aluminium Making, ...

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Mu Star (Shenzhen) Industry Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCB、PCBA、Circuit board
Year of Establishment 2021-12-16
Number of Employees 22
Address Shenzhen, Guangdong, China

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Transaction Info
	Custom Turnkey High-Quality PCB Assembly Factory Automotive Electronic Boards PCBA Contact Now	Quick View Wonderful PCBA Copy Clone PCB Reverse Engineering Printed Circuit Board Contact Now	Quick View LED Motion Sensor LED Lights PCB Assembly Daylight LED PCB PCBA Supplier Contact Now	Quick View Customized Multilayer Prototyping Printed Circuit Boards PCB for Fire Alarm System Contact Now	PCBA Mcp23017 I2c Interface 16bit I/O Extension Module Pin Board Iic to Gipo Converter 25mA1 Drive Power Supply for and C51 Contact Now
Price	US$2.68-5.60 / Piece	US$0.50-4.60 / Piece	US$0.05-3.33 / Piece	US$0.10-15.00 / Piece	US$3.10-8.90 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union
Quality Control
Product Certification	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	-	-	RoHS, UL CE, GS, ISO	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	-	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Width Spacing: 0.015mm; Minimum Line Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1 PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Keyword: Custom PCB; MOQ: 1PCS; Min. Line Spacing: 0.075mm(3mil); Copper Thickness: 18um-3500um(0.5- 100oz); Min. Line Width: 0.075mm(3mil); Min Hole Size: 0.1mm(4mil); Testing Service: 100% E-Testing; Board Thickness: 0.2-6.0mm; Industrial: Industrial Control Board, Motherboard; Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP; Solder Mask: Green, White, Black, Blue, Red(Customized);	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;
Supplier Name	Mu Star (Shenzhen) Industry Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen New Chip international Ltd
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