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      PCBA
      US$2.68-5.60 / Piece
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      What is Industrial Multilayer Fr4 Printed Circuit Board Assembly

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$5.60

      100-999 Pieces US$5.20

      1,000-9,999 Pieces US$3.98

      10,000+ Pieces US$2.68

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Mustar
      • Transport Package Vacuum, Anti-Static, ESD
      • Specification 800*1200mm
      • Trademark Mustar
      • Origin Guangdong
      • Copper Thickness 1-12 Oz
      • Board Thickness 0.8, 1.0, 1.2, 1.6, 2, 2.4mm
      • Surface Finishing HASL,Immersion Gold,Flash Gold, Plated Silver, OSP
      • Minimum Line Spacing 0.015mm
      • Minimum Line Width Spacing 0.015mm
      • Testing Service Ict, Function Test, X-ray, Aoi
      • MOQ 1PCS
      • Certificate RoHS/ISO9001/Ts16949/ISO14001/ISO13485
      • Layers 1-64
      • Warranty 2 Years

      Product Description

      Industrial Multilayer FR4 Printed Circuit Board Assembly Product Description Our Advantages: 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. Professional service: PCB/FPC/Aluminium Making, SMT, ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$2.68-5.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Product Certification RoHS/ISO9001/Ts16949/ISO14001/ISO13485 - - - -
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Supplier Name

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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