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      PCBA
      US$2.68-5.60 / Piece
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      What is Electronic Multilayer Printed Circuit Board SMT DIP Assembly Factory

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$5.60

      100-999 Pieces US$5.20

      1,000-9,999 Pieces US$3.98

      10,000+ Pieces US$2.68

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Mustar
      • Transport Package Vacuum, Anti-Static, ESD
      • Specification 800*1200mm
      • Trademark Mustar
      • Origin Guangdong
      • Copper Thickness 1-12 Oz
      • Board Thickness 0.8, 1.0, 1.2, 1.6, 2, 2.4mm
      • Surface Finishing HASL,Immersion Gold,Flash Gold, Plated Silver, OSP
      • Minimum Line Spacing 0.015mm
      • Minimum Line Width Spacing 0.015mm
      • Testing Service Ict, Function Test, X-ray, Aoi
      • MOQ 1PCS
      • Certificate RoHS/ISO9001/Ts16949/ISO14001/ISO13485
      • Layers 1-64
      • Warranty 2 Years

      Product Description

      Electronic Multilayer Printed Circuit Board SMT DIP Assembly Factory Product Description Our Advantages: 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. Professional service: PCB/FPC/Aluminium ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$2.68-5.60 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece
      Min Order 1 Piece 500 Pieces 500 Pieces 500 Pieces 500 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Product Certification RoHS/ISO9001/Ts16949/ISO14001/ISO13485 - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Supplier Name

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

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