| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Spacing: 0.015mm;
Minimum Line Width Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1PCS;
Layers: 1-64;
Warranty: 2 Years;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Ability to Patch: 104300 Points/H;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Dimensions of Components: 01005 (Imperal)/0402 (Metric);
The Spacing of Components: The Minimum Spacing for IC Is 0.25mm, The Minimum;
The Minimum Spacing for IC Is 0.25mm, Th: up to 30mm;
Accuracy of The Patch: Chip: ±25μm, IC: Class ±30μm;
The Ability to Patch: 104300 Points/H;
PCBA Equipment: First Article Inspection;
Automated Optical Inspection: Solder Paste Inspection;
Automatic Screen Printer: Laser Marking Machine;
Laser Cutting Machine: Nitrogen Reflow Welding Furnace;
Available Components: Connector;
Active Components: Passive Components;
Discretes: Memory Chip;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Ability to Patch: 104300 Points/H;
PCBA Chip Processing: Massive Components in Stock;
High-Speed Bom Order: Selection & Optimization for Material;
Intelligent Counting of Materials: Intelligent Feeding;
Reserve Materials in Advance: Rapid Sampling;
SMT Panasonic High-Speed Patch Machine: DIP Welding & PCB Punching;
Aoi & Spi Detection: Aoi & Spi Detection;
Bulk Delivery Within 3-5 Days: Fast Logistics & Safety Acceptance;
Miniature Waterproof: Massive Component Inventory, Super Cost-Effective;
Wire Harness Processing: Customization of Design Scheme;
Components Selections: SMT Component Installation;
Contract for Labor and Materials of PCBA: Bom Order Allocation;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Ability to Patch: 104300 Points/H;
|