| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Spacing: 0.015mm;
Minimum Line Width Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1PCS;
Layers: 1-64;
Warranty: 2 Years;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Layer Counts: 1-20 Layers;
Board Thickness: 0.20mm-8.00mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Diameter Tolerance(Mechanical): 0.05mm;
Drilling Hole(Mechanical): 0.15mm--6.35mm;
Finish Hole(Mechanical): 0.10mm-6.30mm;
Minimum Space: 0.075mm;
Surface Finishing: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Type: Flexible Circuit Board;
Dielectric: No;
Material: Polyimide;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: No;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Rigid-Flex PCB, FPC, Flexible PCB, Motherboard;
Product Name: Rigid-Flex PCB;
MOQ: 1 PCS;
Technology: Lead The Industry;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: Lead Free HASL;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.2mm/0.2mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.6 mm;
Layer: 2 Layer;
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Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: Lead Free HASL;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.075mm/0.075mm;
Min Hole Diameter: 0.15mm;
Finished Board Thickness: 1.6 mm;
Layer: 4 Layer;
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