| Specification |
Metal Coating: Gold;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: Customized;
Surface Finishing: HASL;
Type: Smart Electronics PCBA;
Solder Mask: White Black Green Blue Red;
SMT Capacity: 7 Million Points/Day;
DIP Capacity: 5 Million Points/Day;
|
Mode of Production: SMT;
Customized: Non-Customized;
Condition: New;
Delivery Time: 1-7days;
MOQ: 1unit;
Part No.1: Kg7-M9236-00X Cylinder Koganei Jda12X5;
Part No.2: Kga-M9179 A0X Cylinder Assy Yv100xg Cylinder+Sens;
Part No.3: Kgd-M9279-01X Koganei Pbsa1010-M Cylinder;
Part No.4: Kgs-M1348-00 Gas Spring Gor Yg12 Ys12 Ys24 Ys100;
Part No.5: Kgs-M9165-00X Cylinder for Yg100 Yg100r;
Part No.6: Kgs-M9605-A0X Cylinder Clamp;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
Customized: Customized;
Condition: New;
MOQ: 1 Piece;
Handing Standards: Ipc-a-600h, Ipc-a-610f, J-Std-001f;
Technical Support: Free Dfm/a Check, Bom Analysis;
Assembly Abilities: SMT 5 Milli Points Per Day, DIP 10 Thousands Piec;
Assembly Details: 5 SMT + 2 DIP (Dust and Anti-Static Lines);
5 SMT + 2 DIP (Dust and Anti-Static Lin: PCB Design + PCB Fab + Components Sourcing + PCB;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming, W;
|
Mode of Production: SMT;
Customized: Non-Customized;
Condition: New;
Delivery Time: 1-7days;
MOQ: 1unit;
Part No.1: Kv7-M9169-00X Brkt Cyl 2 1 for Yv100X Main Stopper;
Part No.2: Kv7-M9169-Oox Brkt Cyl 2 Cylinder;
Part No.3: Kv7-M9237-00X Air Cylinder Pbsa105-W for Yv100X;
Part No.4: Kv7-M9269-02X Pbda10X10-M Cylinder;
Part No.5: Kv7-M9283-00X Ymda1635 Koganei Ymda1635 1W Exit S;
Part No.6: Kv7-M9283-00X Koganei Bdas16X25-259W Air Cylinder;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
|