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      Electronics Component
      US$0.50-1.00 / Piece
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      What is Mustar Reliable PCBA Factory SMT DIP Manufacture Printed Circuit Board Assembly

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-49 Pieces US$1.00

      50-99 Pieces US$0.80

      100-499 Pieces US$0.70

      500-999 Pieces US$0.60

      1,000+ Pieces US$0.50

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, CCC, ISO
      • Customized Customized
      • Condition New
      • Transport Package Carton
      • Specification unlimited
      • Trademark Mustar
      • Origin Shenzhen
      • Shape DIP
      • Conductive Type Bipolar Integrated Circuit
      • Integration Gsi
      • Technics Semiconductor IC
      • D/C Standard
      • Warranty 2 Years
      • Mounting Type Standard, SMT, DIP
      • Cross Reference Standard
      • Memory Type Standard

      Product Description

      Welcome to Mu Star (Shenzhen) Industry Co., LTD Our Advantages 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component ...

      Learn More

      Electronics Component Comparison
      Transaction Info
      Price US$0.50-1.00 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece
      Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Shape: DIP;
      Conductive Type: Bipolar Integrated Circuit;
      Integration: Gsi;
      Technics: Semiconductor IC;
      D/C: Standard;
      Warranty: 2 Years;
      Mounting Type: Standard, SMT, DIP;
      Cross Reference: Standard;
      Memory Type: Standard;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Supplier Name

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

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