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Ultra Thin Die Sorter

US$120,000.00-149,000.00 / Piece

Advanced Semiconductor Packaging Ultra Thin Die Sorter Die Sorting Machine Die Thickness Minimum 50um Video

Name: Advanced Semiconductor Packaging Ultra Thin Die Sorter Die Sorting Machine Die Thickness Minimum 50um
Uploaded: 2026-01-06T18:03:28+08:00
Description: Ultra Thin Die Sorter MDND-120UT Die Thickness Minimum :50um (Thinner Pending Discuss ) Project Parameters Equipment Name MDND-120UT multi-function die bonder Equipment Model MDND-120UT Bonding Accur

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$120,000.00-149,000.00 / Piece

Sepcifications

After-sales Service 1 Year
Condition New
Speed High Speed
Precision High Precision
Certification CE
Warranty 12 Months
Automatic Grade Automatic
Type Ultra High-speed Chip Mounter
Transport Package Wooden Case
Trademark MINDER-HIGHTECH
Origin China

Product Description

Ultra Thin Die Sorter MDND-120UT Die Thickness Minimum :50um (Thinner Pending Discuss ) Project Parameters Equipment Name MDND-120UT multi-function die bonder Equipment Model MDND-120UT Bonding Accuracy/Angle ±20um, ±0.5 (calibration film) Bond Force 50~2000gf CPH 1000 ...

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Guangzhou Minder-Hightech co.,Ltd

Diamond Member Since 2017

Audited Supplier

Main Products Wire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, ...
Year of Establishment 2014-12-30
Address Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital 1,000,000 RMB
Main Markets North America, Europe
International Commercial Terms(Incoterms) EXW

Ultra Thin Die Sorter Comparison

	Advanced Semiconductor Packaging Ultra Thin Die Sorter Die Sorting Machine Die Thickness Minimum 50um Contact Now	Quick View High-Precision Automatic Die Bonder for Efficient LED Packaging Solutions Contact Now	Quick View High Precision Flipchip Eutectic Wafer Bonder with Die Attach Contact Now	Quick View Advanced Flip Chip Die Bonder for Efficient Semiconductor Production Contact Now	Quick View Fully Automatic Semiconductor High-Precision Die Attach Provide Flexible Packaging Equipment Contact Now

Transaction Info
	Advanced Semiconductor Packaging Ultra Thin Die Sorter Die Sorting Machine Die Thickness Minimum 50um Contact Now	Quick View High-Precision Automatic Die Bonder for Efficient LED Packaging Solutions Contact Now	Quick View High Precision Flipchip Eutectic Wafer Bonder with Die Attach Contact Now	Quick View Advanced Flip Chip Die Bonder for Efficient Semiconductor Production Contact Now	Quick View Fully Automatic Semiconductor High-Precision Die Attach Provide Flexible Packaging Equipment Contact Now
Price	US$120,000.00-149,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$100,000.00-200,000.00 / Piece	US$70,000.00-100,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	CE	ISO	ISO	RoHS, ISO, CE	ISO, CE
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, Europe	Europe	Europe	Europe	Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Product Attributes
Specification	After-sales Service: 1 Year; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: Flip Chip Die Bonder; Feature 1: High Precision; Feature 2: High Efficiency; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided; Uph: 15,000 to 20,000; Placement Accuracy: +/-10 Um; Die Size Capability: 0.20.2mm to 2525mm; Dispensing Pattern: Dots, Lines, Crosses, or Snowflakes; Hybrid Bonding: Ultra-Thin 3D Stacked Chips;
Supplier Name	Guangzhou Minder-Hightech co.,Ltd	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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