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      USB3.0 Tensorflow Caffe Onnx Darknet Ai Artificial Intelligence Computing Stick Rockchip 1808 Edge Computing Ai Accelerator

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      200 Pieces US$70.00 / Piece

      Sepcifications

      • Application Field Industrial Control
      • Processor Type ARM
      • Stratification HardWare Layer
      • Range of Application General
      • Certification CE, RoHS, FCC
      • Type Embedded Systems
      • Transport Package White Box
      • Specification 72*28.4*11.6mm
      • Origin China
      • CPU Rockchip 1808 Dual Cortex-A35 up to 1.6GHz
      • Npu 3tops for Int8/300 Gops for Int16/100 Gflops for F
      • Support Model Tensorflow, Caffe, Onnx, Darknet
      • Operation System Linux
      • Memory 1g DDR4, 8g Emmc
      • Material Plastic

      Product Description

      * Description: AI Artificial Intelligence Computing stick * Model: R8-10 * Chipset: Rockchip 1808 * Dual cortex-A35 up to 1.6Ghz * High performance NPU * NPU 3TOPS for INT8/300 GOPs for INT16/100 GFLOPs for FP16 * Support OpenCL/OpenVX * Support TensorFlow, Caffe, ONNX, Darknet * Product ...

      Learn More

      Npu 3.0 Tops Ai Accelerator USB3.0 Comparison
      Transaction Info
      Price US$70.00 / Piece US$168.00-285.00 / Piece US$68.00-91.00 / Piece US$228.80-232.70 / Piece US$50.00-67.00 / Piece
      Min Order 200 Pieces 1 Piece 2 Pieces 1 Piece 2 Pieces
      Payment Terms T/T, PayPal T/T, PayPal LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
      Management System Certification - - - ISO9001:2015 -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model - - ODM, OEM Own Brand, ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: Embedded Systems;
      CPU: Rockchip 1808 Dual Cortex-A35 up to 1.6GHz;
      Npu: 3tops for Int8/300 Gops for Int16/100 Gflops for F;
      Support Model: Tensorflow, Caffe, Onnx, Darknet;
      Operation System: Linux;
      Memory: 1g DDR4, 8g Emmc;
      Material: Plastic;
      Application Field: Industrial Control;
      Processor Type: Intel;
      Stratification: HardWare Layer;
      Range of Application: General;
      Bus Type: Bus Type;
      Type: Embedded SBC;
      Machine Word-Length: 8;
      Instruction Type: CISC;
      COM: 2,RS485 Optional;
      Power: DC 12V Power Supply (DC 9-36V Optional);
      LAN: 2* Gigabit LAN;
      Display: 1*VGA,1*HDMI;
      USB: 6;
      Processor: Onboard N100 N200 N250 N95;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som+ Carrier Board;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      GPU: Arm Mali-G52 Mc3;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Type: Embedded Systems;
      Processor: RK3562J/RK3562;
      RAM: 1/2/4GByte LPDDR4X;
      ROM: 8/16/32GByte eMMC;
      Ethernet Port: 1 to 3 ports, 3x10/100M;
      Antenna: 2x, used for 4G/WIFI/GPS, and other modules;
      Core: 4x ARM Cortex-A53 (64-bit) +1xM0;
      Digital Input: YES;
      Digital Output: YES;
      RK3562 clock speed: 2.0GHz;
      Analog Input: YES;
      Analog Output: YES;
      USB: 2xUSB 2.0 HOST;
      NPU: 1TOPS;
      SIM Slot: 1, NANO;
      Debug: 1x Micro USB debugging port.;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Supplier Name

      Mekotronics Co., Ltd.

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Beilai Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

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