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      Mulitlayer
      US$20.00 / Square Meter
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      What is PCB 1

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      10 Square Meters US$20.00 / Square Meter

      Product Description

      Mulitlayer Comparison
      Transaction Info
      Price US$20.00 / Square Meter US$1.50-6.00 / Piece US$1.50-6.00 / Piece US$0.37-0.57 / Piece US$0.37-0.57 / Piece
      Min Order 10 Square Meters 10 Pieces 10 Pieces 1 Piece 1 Piece
      Payment Terms T/T, LC, D/P, PayPal, Western Union, Small-amount payment, Money Gram, cash LC, D/P, T/T, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - ISO9001:2015 ISO9001:2015 - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model ODM, OEM ODM ODM - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: OEM;
      Copper Thickness: 1/2oz 1oz 2oz 3oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Width: 0.075mm;
      Surface Finishing: HASL/OSP/Enig;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: OEM;
      Copper Thickness: 1/2oz 1oz 2oz 3oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Width: 0.075mm;
      Surface Finishing: HASL/OSP/Enig;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: Ulsi;
      Technics: Thick Film IC;
      Regular Board Thickness: 1.6mm;
      Board Material: Fr4, Bt HDI Material;
      Board Layer: 4 Layers;
      Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
      Copper Thickness: 1 Oz;
      Thickness of Copper Foil Wire: 8-240 Um(4oz);
      Min. Hole Size: 0.075mm(3mil);
      Min Pad: +/- 0.1mm (4mil);
      Min Board Thickness: 0.1mm Only for Single and Double Sided;
      Min. Line Width/Space: 0.05mm (2mil);
      Outline Machining Accuracy: +/- 0.1mm (4mil);
      Lead Time: 6-8 Working Days;
      Silksreen: Any You Like;
      Solder Mask: Any You Like;
      MOQ: 1PCS;
      Shape: Round;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: Ulsi;
      Technics: Thick Film IC;
      Regular Board Thickness: 1.6mm;
      Board Material: Fr4, Bt HDI Material;
      Board Layer: 4 Layers;
      Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
      Copper Thickness: 1 Oz;
      Thickness of Copper Foil Wire: 8-240 Um(4oz);
      Min. Hole Size: 0.075mm(3mil);
      Min Pad: +/- 0.1mm (4mil);
      Min Board Thickness: 0.1mm Only for Single and Double Sided;
      Min. Line Width/Space: 0.05mm (2mil);
      Outline Machining Accuracy: +/- 0.1mm (4mil);
      MOQ: 1PCS;
      Supplier Name

      Guangdong Longxing Integrated Circuit Co., Ltd.

      Gold Member Audited Supplier

      Dongguan Access Star Co., Ltd.

      Gold Member Audited Supplier

      Dongguan Access Star Co., Ltd.

      Gold Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier