| Specification |
Main Chip: Ne555;
Input Voltage: 5V-15VDC;
Input Current: Greater Than = 100mA;
Material: Metal;
Output Amplitude: 4.2VV PP to 11.4V V PP;
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Versions: [H610] Without SPF;
Mating: Single Board + Quasi System + Power Supply;
Processor System: Intel12 Generation Alder Lake-S Series /13 Generat;
Memory: 2xddr4 50-DIMM, Maximum 64GB;
Power Supply: ATX 24+8 Pin Power Supply, More Than 300W;
Storage: 1xm.2m-Key2280(Nvme Pcle 3.0X4) Storage Interface;
Display: 1xhdmi2.0 Interface, Support [email protected];
Board Edge I/0 Interface: 1 Xrj45 Console,2xusb3.26xlan Interface (I226; LAN;
Extended Interface / Function: Tpm2.0 Optional, Default None; 1xusb2.0 2X5pin, Sp;
System Support: Windows10,Windows11,Linux;
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Versions: H610;
Mating: Wk310ca, Motherboard;
Processor System: Support for LGA1700 Intel12 and 13:I3-I5-I7-I9/ PE;
Memory: 2*DDR4 50-DIMM 260 Socket Memory Slot Maximum Supp;
Power Supply: 1u ATX 24+8 Pin Power Supply, More Than 300W;
Store: 1 Xm.2 M-Key 2280, Nvme Pcle 3.0 X4 Protocol 4xsat;
Display: 1xhdmi Interface;
Interface: 1xrj45 Console, 2xusb3.2, 6xlan (Eth1-2, Eth3-4 by;
Rear Panel Interface: 2X6025 System Fan (Default Two),1X Power Switch,1X;
Internal Main Board Extend Functionality: Tpm2.0 Optional, Default Not Available 1xm.2 E-Key;
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Versions: Core 11 Generation;
Mating: All-in-One Machine;
Processor System: Integrated Intel 6/7 Generation Mobile Skylake/Kab;
Memory: 2*DDR4 SODIMM 260 Socket;
Colour: Gray;
CS(Chipset): Intel Single Chip;
Memory Slot: 2*DDR4 SODIMM 260 Socket;
Storing Device: 1*Minisata SSD:1*SATA3.0;
Panel Interface: 6*LAN1*HDMI1*DC4*USB3.02*WiFi Antenna Interface 1*;
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Working Temperature: -45℃ /+50℃;
Transport and Storage Temperature: 10℃ /+50℃;
Installation Temperature: 10℃ /+50℃;
Recommended Blowing Temperature: -15℃ /+35℃;
Working Pressure: 20 Bar;
Max. Pressure: 28 Bar;
High Pressure Resistance(Safety): >50bar;
Protection Class: IP68;
According to Standards: Cei En 50411-2-8, En 50411-2-5;
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