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      Multi-Layer PCB/PCBA Circuit Board
      US$1.00-50.00 / Piece
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      What is OEM ODM Service PCB&PCBA Layout and Design Customized

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-50.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Communication
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Delay Pressure Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Customized
      • Transport Package Inner Vacuum Packing, Outer Carton
      • Specification Customized
      • Trademark Customized
      • Origin China
      • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
      • Layer 1-32
      • Outline Profile Rout/ V-Cut Bridge/ Stamp Hole
      • Max Production Size 600*800mm

      Product Description

      1. Design and produce single-sided, double-sided, and multi-layer PCB/PCBA, with competitive prices, high quality, and good service; 2. CEM-1, CEM-3, FR-4, FR-4 high TG, aluminum based materials can be choosed; 3. Surface treatment methods include HAL, HAL lead-free, gold/silver/tin plating, ...

      Learn More

      Multi-Layer PCB/PCBA Circuit Board Comparison
      Transaction Info
      Price US$1.00-50.00 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece
      Min Order 1 Piece 5 Pieces 5 Pieces 5 Pieces 5 Pieces
      Payment Terms LC, T/T, D/P, PayPal LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Supplier Name

      KTB Jilin Technology Co., Ltd.

      Gold Member

      Shanghai Jumptop Trading Co Ltd

      Gold Member Audited Supplier

      Shanghai Jumptop Trading Co Ltd

      Gold Member Audited Supplier

      Shanghai Jumptop Trading Co Ltd

      Gold Member Audited Supplier

      Shanghai Jumptop Trading Co Ltd

      Gold Member Audited Supplier

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