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      Multi-Layer PCB/PCBA Circuit Board
      US$1.00-50.00 / Piece
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      What is Rout V-Cut Stamp Hole 1-32 Layer Large Size Custom PCB Design Service

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-50.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Communication
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Delay Pressure Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Customized
      • Transport Package Inner Vacuum Packing, Outer Carton
      • Specification Customized
      • Trademark Customized
      • Origin China
      • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
      • Layer 1-32
      • Outline Profile Rout/ V-Cut Bridge/ Stamp Hole
      • Max Production Size 600*800mm

      Product Description

      1. Design and produce single-sided, double-sided, and multi-layer PCB/PCBA, with competitive prices, high quality, and good service; 2. CEM-1, CEM-3, FR-4, FR-4 high TG, aluminum based materials can be choosed; 3. Surface treatment methods include HAL, HAL lead-free, gold/silver/tin plating, ...

      Learn More

      Multi-Layer PCB/PCBA Circuit Board Comparison
      Transaction Info
      Price US$1.00-50.00 / Piece US$0.10-5.00 / pieces US$0.10-5.00 / pieces US$0.30-5.00 / pieces US$0.30-5.00 / pieces
      Min Order 1 Piece 1 pieces 1 pieces 5 pieces 5 pieces
      Payment Terms LC, T/T, D/P, PayPal LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification - ISO9001.ISO45001.Is014001 ISO9001.ISO45001.Is014001 RoHS, Is09001:2000 RoHS, Is09001:2000
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Ycx;
      Copper Thickness: 0.3-60z;
      Basematerial: Fr4 Any Specialized Material as Per Your Choice;
      Range of Tg: 130-215c;
      Min. Hole Size: 0.2mm;
      Service: One Stop OEM Services;
      Min.Line Spacing: 0.1mm;
      MOQ: 1PC;
      Layer Count: 1 to 28 Layers;
      Twisting and Bending: 0.75%Min:0.5%;
      Item: PCB&PCBA;
      Silkscreen Colon: Black,Whitered Green;
      Board Size: OEM;
      Min.Line Width: 0.1 mm;
      Board Thickness: 0.3mm-4mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Ycx;
      Copper Thickness: 0.3-60z;
      Basematerial: Fr4 Any Specialized Material as Per Your Choice;
      Range of Tg: 130-215c;
      Min. Hole Size: 0.2mm;
      Service: One Stop OEM Services;
      Min.Line Spacing: 0.1mm;
      MOQ: 1PC;
      Layer Count: 1 to 28 Layers;
      Twisting and Bending: 0.75%Min:0.5%;
      Item: PCB&PCBA;
      Silkscreen Colon: Black,Whitered Green;
      Board Size: OEM;
      Min.Line Width: 0.1 mm;
      Board Thickness: 0.3mm-4mm;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4,Tg,Cem-1,Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Number of Layers: 2/4/6/8/12/Custom;
      Copper Thickness: 0.5-6.0oz;
      Min.Hole Size: 0.1mm;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.15mm;
      Board Size: Custom;
      Board Thickness: 0.2-4.0mm;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4,Tg,Cem-1,Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Number of Layers: 2/4/6/8/12/Custom;
      Copper Thickness: 0.5-6.0oz;
      Min.Hole Size: 0.1mm;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.15mm;
      Board Size: Custom;
      Board Thickness: 0.2-4.0mm;
      Supplier Name

      KTB Jilin Technology Co., Ltd.

      Gold Member

      Sichuan Concentric Circle Wisdom Technology Co., Ltd.

      Diamond Member Audited Supplier

      Sichuan Concentric Circle Wisdom Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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