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      Multi-Layer PCB/PCBA Circuit Board
      US$1.00-50.00 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-50.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Communication
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Delay Pressure Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Customized
      • Transport Package Inner Vacuum Packing, Outer Carton
      • Specification Customized
      • Trademark Customized
      • Origin China
      • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
      • Layer 1-32
      • Outline Profile Rout/ V-Cut Bridge/ Stamp Hole
      • Max Production Size 600*800mm

      Product Description

      1. Design and produce single-sided, double-sided, and multi-layer PCB/PCBA, with competitive prices, high quality, and good service; 2. CEM-1, CEM-3, FR-4, FR-4 high TG, aluminum based materials can be choosed; 3. Surface treatment methods include HAL, HAL lead-free, gold/silver/tin plating, ...

      Learn More

      Multi-Layer PCB/PCBA Circuit Board Comparison
      Transaction Info
      Price US$1.00-50.00 / Piece US$0.50-1.00 / Piece US$8.00-20.00 / pcs US$2.00-8.00 / Piece US$0.50-6.00 / Piece
      Min Order 1 Piece 1 Piece 1 pcs 2 Pieces 1 Piece
      Payment Terms LC, T/T, D/P, PayPal T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union
      Quality Control
      Product Certification - - CE, RoHS, UL, SGS, ISO9001: 2015, 94V0 - -
      Management System Certification - - ISO14001, Others - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia South America North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Sthl Electronic Card Manufacturer PCBA;
      MOQ: 1 PCS;
      Layer: 1-24 Layers;
      Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
      PCB Thickness: 0.2mm-4mm;
      Min.Hole Size: 0.1mm (4 Mil);
      Min.Line Spacing: 0.1mm (4 Mil);
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
      PCBA Specialised: CE, LED, Medical, Industrial, Control Board;
      Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
      Package: ESD Bag, Foam and Cartons;
      Service: PCB, PCBA, PCB Assembly, SMT, DIP;
      Other Service: PCBA Layout and Design, Engineering Support;
      Products Name: 94V0 Circuit Board Electronic Card PCBA;
      Type: Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: New Chip;
      Soldermask Color: Green, Yellow, Blue, Black, White...;
      Sample: Available;
      OEM/ODM: Available;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Color of Silk Screen: Green, Purple, Black;
      Service: OEM / Dfm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Supplier Name

      KTB Jilin Technology Co., Ltd.

      Gold Member

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen STHL Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

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