| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jingxin or Customized;
Copper Thickness: 2 Oz;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Silkscreen Color: Black.White.Yellow;
PCBA Package: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: PCBA Testing Service;
Supplier Type: PCBA Manufacturer;
Maximum Board Size: 500mm*1200mm;
Service: One-Stop Turnkey;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Andriod Pab Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Silkscreen: White, Black, Green, Yellow;
Soldermask: White, Black, Green, Yellow;
Surface Finishing: HASL;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Board Thickness: 1.0mm;
Copper Thickness: 1oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Light;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.2mm;
Min.Hole Size: 0.3mm;
Min.Line Width: 0.2mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
Copper Thickness: 1oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Telecommunications;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Soldermask: Green;
Silkscreen: White;
Test: Flying Probe and Fixture;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Stencil Offer: Yes;
Impedence Control: Yes;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Mobile Phone;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: Enig;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.3mm;
Min.Line Wigth: 0.20mm;
Min. Line Spacing: 0.3mm;
Layer: 2;
Solder Mask: Green;
Legend Mask: White;
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