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      PCB
      US$1.99-3.99 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9,999 Pieces US$3.99

      10,000+ Pieces US$1.99

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Model FR-4
      • Brand OEM
      • Transport Package Carton Box
      • Specification 500 PCS/CTN
      • Trademark Customer's brand
      • Origin China

      Product Description

      Shenzhen Jingxin Electronic Technology Co.,Ltd China PCBA Manufacturer | 23 Years Expertise | 18 SMT + 13 DIP Lines Your Trusted Turnkey PCB Assembly Partner With 23 years of industry experience, we are a leading PCBA manufacturer in China, offering end-to-end solutions from prototyping to ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$1.99-3.99 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Model: FR-4;
      Brand: OEM;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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