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      PCBA
      US$2.00-4.50 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-499 Pieces US$4.50

      500-999 Pieces US$4.00

      1,000-4,999 Pieces US$3.50

      5,000-9,999 Pieces US$2.85

      10,000+ Pieces US$2.00

      Sepcifications

      • Structure Multilayer Rigid PCB
      • Dielectric FR-4
      • Material Epoxide Woven Glass Fabric Laminate
      • Application Consumer Electronics
      • Flame Retardant Properties HB
      • Processing Technology Electrolytic Foil
      • Production Process Subtractive Process
      • Base Material Aluminum
      • Insulation Materials Epoxy Resin
      • Brand Jxpcba
      • Transport Package ESD Bag+Bubble Wrapped +Carton
      • Specification customized PCBA
      • Trademark jxpcba
      • Origin China
      • Layer 1-32 Layers
      • Board Thickness 0.2-8.0mm
      • PCBA Testing PCB: Ict Testing and Flying Probe Testing, PCBA: a
      • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
      • Qualified Ipc-a-610cclass 2 Standard
      • Thick Copper 18um-140um(4oz)
      • Service OEM/ODM, EMS

      Product Description

      PCB assembly OEM service Electronic components material purchasing Bare PCB fabrication PCB Assembly Service. (SMT, BGA, DIP) FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT) Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service Conformal coating service ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$2.00-4.50 / Piece US$0.01-150.00 / Piece US$3.52-3.61 / Piece US$0.32-0.45 / piece US$0.71-0.90 / Piece
      Min Order 10 Pieces 1 Piece 1 Piece 1 piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification Others - - - -
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxide Woven Glass Fabric Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      Layer: 1-32 Layers;
      Board Thickness: 0.2-8.0mm;
      PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Qualified: Ipc-a-610cclass 2 Standard;
      Thick Copper: 18um-140um(4oz);
      Service: OEM/ODM, EMS;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxide Woven Glass Fabric Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Surface Finishing: Enig 2u'';
      Thickness: 1.0mm;
      Solder Mask: Green;
      Silk: White;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
      Application: Communication, Consumer Electronics;
      Flame Retardant Properties: V1, V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4, Copper;
      Insulation Materials: Epoxy Resin, Organic Resin;
      Brand: Fastline;
      Type: Rigid Circuit Board;
      Mechanical Rigid: Rigid;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Material Type: Fr4;
      Surface Treatment: HASL Lead Free;
      Solder Mask: Green;
      Silk Screen Color: White;
      Board Layer: 1-50;
      Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
      Packing Type: Carton + Vacuum;
      Lead Time: 5-7 Days;
      Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
      Dielectric: Fr-3, FR-4;
      Material: Phenolic Paper Laminate, Polyester Glass Fiber Mat Laminate;
      Application: Computer, Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process, Subtractive Process;
      Base Material: Fr4, Copper;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 4 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Blue;
      Silksreen: White;
      Surface Finihsing: HASL-Lf;
      Lead Time: 6-8 Working Days;
      Min. Line Width/Space: 0.1mm;
      Min. Hole Size: 0.2mm;
      Board Material: Fr4;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

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