Printed Circuit Boards

US$0.49-1.98 / Piece

Custom PCBA for Digital Product Electronic Component PCB Assembly Manufacturer PCBA pictures & photos

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What is Custom PCBA for Digital Product Electronic Component PCB Assembly Manufacturer PCBA

Name: Custom PCBA for Digital Product Electronic Component PCB Assembly Manufacturer PCBA
Uploaded: 2025-12-22T03:14:40+08:00
Description: Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS

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Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$1.98

100-999 Pieces US$1.21

1,000-1,999 Pieces US$0.96

2,000+ Pieces US$0.49

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Consumer Electronics
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Brand Jxpcba
Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
Specification Custom HDI PCBA
Trademark JXpcba
Origin China
Product Type Custom HDI PCBA
Service One-Stop Turnkey
Applicational Electronics Device/Home Appliances
Testing Service Aoi X-ray Function Test
Raw Material Fr4/Cem-1/Cem-3/Fr1/Aluminum
Board Thickness 0.2mm-7.0mm
Layer 1-32 Layers
Solder Mask Color Blue.Green.Red.Black.White.etc
Surface Finishing HASL\OSP\Immersion Gold
Certificate ISO9001/ISO14001/CE/RoHS
Component Packing Tary, Tube, Tape
PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
PCBA Application Consumer Electronics/Home Appliances/Medical Equip
PCB Silkscreen Color Black, White, Yellow
Maximum Board Size 640mm*1200mm

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: 0.5-5oz ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCBA, PCB, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, ...
Year of Establishment 2006-08-03
Number of Employees 423
Management System Certification Others
Address 2-3f, Building 17, 2f, Building 13 Hongfa Industrial Park, Tangtou, Shenzhen, Guangdong, China

Printed Circuit Boards Comparison

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Transaction Info
	Custom PCBA for Digital Product Electronic Component PCB Assembly Manufacturer PCBA Contact Now	Quick View OEM LED PCB for Automotive Lighting 1.5mm T2 Copper Core Multilayer Solution Contact Now	Quick View Chinese PCB Manufacturing Factory Quick-Turn Prototype Copper Substrate PCB 70μ M Tg150° C Customizable Solution Contact Now	Quick View Chinese PCB Manufacturing Factory Copper PCB Substrate 398W/M· K T2 Copper for High-Power Lighting Contact Now	Quick View OEM Manufacturer Single-Sided Thermal-Electric PCB T2 Copper Core Contact Now
Price	US$0.49-1.98 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Product Certification	ISO9001/ISO14001/CE/RoHS	-	-	-	-
Management System Certification	Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Jxpcba; Product Type: Custom HDI PCBA; Service: One-Stop Turnkey; Applicational: Electronics Device/Home Appliances; Testing Service: Aoi X-ray Function Test; Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum; Board Thickness: 0.2mm-7.0mm; Layer: 1-32 Layers; Solder Mask Color: Blue.Green.Red.Black.White.etc; Surface Finishing: HASL\OSP\Immersion Gold; Component Packing: Tary, Tube, Tape; PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop; PCBA Application: Consumer Electronics/Home Appliances/Medical Equip; PCB Silkscreen Color: Black, White, Yellow; Maximum Board Size: 640mm1200mm;*	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.5mm; Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm; Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°c;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Board Thickness: 2.0mm; Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm; Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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