| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
MOQ: at Least 1piece;
Delivery Term: Fob Shenzhen;
Payment Term: by T/T in Advance;
Leadtime: 15days After Receipt of Your Full Payment;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: USB;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Surface Finishing: HASL Lead-Free;
Solder Mask Type: Blue;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Customized;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Min Hole Size: 0.4mm;
Min Line Width: 0.2mm;
Surface Finishing: Enig, OSP, Hal, Immersion Tin/Gold;
Test Mode: Flight Tst;
Service: One-Stop Service;
Board Thickness: 2.4mm;
Min Line Spacing: 0.2mm;
Solder Mask: Green;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Silkscreen: White,Black,Green,Yellow;
Soldermask: White,Black,Green,Yellow;
Surface Finishing: HASL,Immersion Gold;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Board Thickness: 1.2mm;
Layer: 1 to 28;
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Structure: Double-Sided Rigid PCB;
Dielectric: CEM-3;
Material: Polyester Glass Fiber Mat Laminate;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Copper Thickness: 35um;
Surface Finishing: HASL Lf/OSP;
Solder Mask: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min Line Spacing: 6 Mil;
Min Line Width: 6 Mil;
Min Hole Size: 0.2mm;
Layer: 1 to 4layer;
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