| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
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Type: Rigid Circuit Board;
Dielectric: Megtron 6 High-Speed;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Brand: Rogers;
Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
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Type: Rigid Circuit Board;
Dielectric: RO4830;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Brand: Rogers;
Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
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Type: Rigid Circuit Board;
Dielectric: RF-10;
Material: Ceramic-Filled PTFE + Woven Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Surface Finish: Immersion Gold;
Board Thickness: 0.3mm (Finished);
Layer Count: 2-Layer;
Solder Mask: No;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Material: Polyimide;
Copper Thickness: 1oz;
Board Thickness: 0.8mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 01mm;
Min. Line Spacing: 0.09mm;
Surface Finishing: Enig;
Is_Customized: Yes;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
MOQ: 1PCS;
Soldermask: White, Black, Blue, Red Ect;
Silkcreen: White, Black, Blue, Red Ect;
File: PCB File;
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