| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: OEM;
Layer: 1-58layers;
Solder Mask: Green.Blue.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Organic-Ceramic Woven Fiberglass Reinforced Lamina;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Thickness: 50mil;
Layer Count: 2-Layer;
Application: Power Amplifiers;
Surface Finish: Immersion Silver;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 30.7mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Digital Application;
Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
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Type: Rigid Circuit Board;
Dielectric: Rt/Duroid 6035HTC;
Material: Ceramic-Filled PTFE Composite;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Bare Copper;
Board Thickness: 0.6mm(Finished);
Layer Count: 2-Layer;
Solder Mask: None;
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