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      PCBA Protypes
      US$2.00-9.00 / Piece
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      What is Electronics Assembly SMT DIP PCB PCBA Protypes

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-998 Pieces US$9.00

      999-9,998 Pieces US$6.00

      9,999+ Pieces US$2.00

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V2
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Jingxin
      • Transport Package Carton Box
      • Specification 200pcs/CTN
      • Trademark Customer′ s brand
      • Origin China
      • PCB Layers 2 Layers
      • PCB Assembly Yes
      • SMT Yes
      • DIP Yes

      Product Description

      Shenzhen Jingxin Electronic Technology Co.,Ltd(JXE )has offered high-quality PCBs and the best PCB assembly service all over the world since 2002. We have been specializing in quick-turn PCB prototyping and turnkey PCB assembly services and are one of China's leading companies in the industry. ...

      Learn More

      PCBA Protypes Comparison
      Transaction Info
      Price US$2.00-9.00 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece
      Min Order 1 Piece 500 Pieces 500 Pieces 500 Pieces 500 Pieces
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Management System Certification Others - - - -
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Jingxin;
      PCB Layers: 2 Layers;
      PCB Assembly: Yes;
      SMT: Yes;
      DIP: Yes;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Tenxin;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

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