| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: OSP;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: Blue;
Size: 66*56mm;
Package: Vacuum;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: :Immersion Tin/Sn, RoHS;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 560mm*460mm;
Min. Hole Size: 0.2mm;
Min. Line Width: Min. 5mil / 5mil;
Min. Line Spacing: Min. 5mil / 5mil;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Green Solder Mask: Green;
Surface Finish: HASL-Lead Free;
Board Thickness: 1mm;
Min Hole Size: 0.6mm;
Min Line Width: 4mil;
Min Line Spacing: 4mil;
Surface Finishing: Hal, Immersion Gold, Ect;
Package: Vacuum;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Industrial Products;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Silkscreen: White, Black, Red;
Solder Mask: Green, Yellow, Red, White, Black, Blue;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Min Line Spacing: 0.2mm;
Min Line Width: 0.2mm;
Min Hole Size: 0.25mm;
Package: Vacuum;
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