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      Printed Circuit Board Assembly
      US$1.00-4.00 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 Pieces US$4.00

      10-999 Pieces US$3.00

      1,000-9,999 Pieces US$2.00

      10,000+ Pieces US$1.00

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Complex
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Model PCB
      • Brand OEM
      • Transport Package Carton Box
      • Specification 200 PCS/CTN
      • Trademark Customer's brand
      • Origin China
      • Test Aoi/Spi/X-ray
      • Production Methods SMT/DIP/Assembly
      • Packing Carton/Vacuum/Plastic
      • Delivery 7-15 Days Sample

      Product Description

      Company Profile Shenzhen Jingxin Electronic Technology Co., Ltd. Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional IEM electronic manufacturing services for customers in various fields ...

      Learn More

      Printed Circuit Board Assembly Comparison
      Transaction Info
      Price US$1.00-4.00 / Piece US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.80-2.60 / Piece
      Min Order 1 Piece 1 PCS 1 PCS 1 PCS 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, Western Union
      Quality Control
      Management System Certification Others - - - ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Model: PCB;
      Brand: OEM;
      Test: Aoi/Spi/X-ray;
      Production Methods: SMT/DIP/Assembly;
      Packing: Carton/Vacuum/Plastic;
      Delivery: 7-15 Days Sample;
      Type: Rigid Circuit Board;
      Dielectric: Tu-768;
      Material: Epoxy Resin System Reinforced with Woven E-Glass;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Tuc;
      Surface Finish: Hot Air Soldering Level;
      Board Thickness: 1.6mm (Finished);
      Layer Count: 2-Layer;
      Solder Mask: Green;
      Type: Rigid Circuit Board;
      Dielectric: RO4533;
      Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Rogers;
      Surface Finish: Immersion Gold;
      Board Thickness: 0.6mm (Finished);
      Layer Count: 2-Layer;
      Solder Mask: Green(Top);
      Type: Rigid Circuit Board;
      Dielectric: Isoclad 933;
      Material: Non-Woven Fiberglass/PTFE Composite;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Rogers;
      Surface Finish: Immersion Tin;
      Board Thickness: 0.9mm (Finished);
      Layer Count: 2-Layer;
      Solder Mask: Blue (Top);
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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