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      OEM Assembly
      US$2.547-3.265 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 Pieces US$3.265

      10-99 Pieces US$3.025

      100-999 Pieces US$2.753

      1,000+ Pieces US$2.547

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Dielectric FR-4
      • Material Complex
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Aluminum
      • Insulation Materials Organic Resin
      • Model PCB
      • Brand Customer's Brand
      • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
      • Specification 49 x 42 x 36 Centimeters/Piece
      • Trademark JXpcba
      • Origin China
      • Surface Treatment Gold Finger/Hard Gold
      • Layers 1-36layers
      • Board Thickness 0.2-6mm
      • Copper Thickness 0.5-12oz(18-420um)
      • Solder Mask Color Green/Black/White/Red/Blue/Yellow
      • Hole Diameter Min0.05mm
      • Min. Line Width 0.10mm(4mil)
      • Min. Line Spacing 0.10mm(4mil)
      • Test 100% E-Test
      • One Stop Service PCB Assembly, Component Sourcing, Box Building
      • Max. Finished Board Side 1020mm*1000mm
      • MOQ No
      • Sample Date 5-7days
      • Certification RoHS, UL, ISO
      • Shipment Air,Sea,Express(DHL TNT FedEx EMS UPS)

      Product Description

      Company Profile ... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than ...

      Learn More

      OEM Assembly Comparison
      Transaction Info
      Price US$2.547-3.265 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Product Certification RoHS, UL, ISO - - - -
      Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Model: PCB;
      Brand: Customer's Brand;
      Surface Treatment: Gold Finger/Hard Gold;
      Layers: 1-36layers;
      Board Thickness: 0.2-6mm;
      Copper Thickness: 0.5-12oz(18-420um);
      Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
      Hole Diameter: Min0.05mm;
      Min. Line Width: 0.10mm(4mil);
      Min. Line Spacing: 0.10mm(4mil);
      Test: 100% E-Test;
      One Stop Service: PCB Assembly, Component Sourcing, Box Building;
      Max. Finished Board Side: 1020mm*1000mm;
      MOQ: No;
      Sample Date: 5-7days;
      Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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