| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Surface Treatment: Gold Finger/Hard Gold/etc;
Layers: 1-32 Layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Max. Finished Board Side: 1020mm*1000mm;
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
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Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
Dielectric: Fr-3, FR-4;
Material: Phenolic Paper Laminate, Polyester Glass Fiber Mat Laminate;
Application: Computer, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process, Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4, Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green and Yellow and Red;
Silk Screen: White;
PCB Type: Rigidpcb;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Serive: High Quality;
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Structure: 8 Layer;
Dielectric: FR-4;
Material: Fr4;
Application: Aerospace;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 170 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: Immersion Gold;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Immersion Gold Circuit Board Multilayer PCB;
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Structure: 10 Layer;
Dielectric: FR-4;
Material: Fr4;
Application: Aerospace;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: Immersion Gold;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Fast Turn Enig Fr4 Rigid PCB Circuit Board Manufac;
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