| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: Jx-PCBA;
Brand: Customer's Brand;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Minimum Mechanical Drilling Aperture: 6mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Raw Material: FR4/Cem-1/Cem-3/FR1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue, Green, Red, Black, White., etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 4mil;
Min.Hole Size: 0.2mm;
Min.Line Width: 4mil;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
Surface Finishing: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: PCB;
Surface Finishing: Immersion Gold;
Copper Thickness: 35um;
Board Thickness: 1mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Layer: 2;
Solder Mask: Green;
Legend Mask: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: UL;
Insulation Materials: Organic Resin;
Model: USB;
Copper Thickness: 1oz;
Surface Finishing: HASL;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Solder Mask: Green Blue Red White Biack etc;
Test: Aol;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Layer: 1 to 16;
Color: Green,White,Black,Ect;
Min Hole Size: 0.2mm;
Min Line Width: 0.1mm;
Min Line Spacing: 0.1mm;
Surface Finish: HASL,Immersion Gold,OSP;
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