| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg,etc;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 500* 1200mm;
Min.Drilled Hole Size: 0.2mm;
Min.Line Width: 0.05mm(2mil);
Min.Line Spaceing: 0.05mm(2mil);
Copper Thickness: 1/20z, 10z, 20z, 30z;
Hole Tolerance: Pth:±0.076,Ntph: ±0.05;
Placement Precision: Qfp, Sop, Plcc, BGA;
SMT Jointing Capability: 1206, 0805, 0603, 0402, 0201;
Test: X-ray, Aoi, in-Circuit Test , Functional Test;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: OEM/ODM;
PCB: PCB Board;
Products Name: High Quality Facotry Price Custom PCB;
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Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 Mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 Mm;
Min Line Width&Space: 0.15 Mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Fastline Rigid PCB Circuits Board;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf/Immersion Gold/Immersion Tin/;
Lead Time: 6-8 Working Days;
Test: Fly Probe Testing;
Max PCB Size: 1200*500mm;
Minimum Order: 1 PCS;
Min Board Thickness: Single and Double Sided Is 0.1mm;
Min Pad: +/-0.1mm(4mil);
Min Conductor Width: 0.05mm (2mil);
Min Conductor Spacing: 0.05mm (2mil);
Thickness of Copper Foil Wire: 8-240um (4oz);
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Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Brand: Ca;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White;
Silksreen: Black;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
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