| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
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Type: Rigid Circuit Board;
Dielectric: Fr4+Pi;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid +Flex;
Processing Technology: Electrolytic Foil;
Base Material: Fr4+Pi;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr4+Pi;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Product Name: PCB Manufacturer Immersion Gold 8L Rigid Flex PCB;
Package: Carton + Vacuum;
Small Order: 1 PCS;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Plastic, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin, Epoxy Resin;
Usage: Commercial Refrigerator & Freezer;
Parts: Condenser;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: Hb, V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Structure: Multilayer Rigid PCB;
Production Process: Subtractive Process;
Board Material: Polyimide;
Copper Thickness: 1oz;
Board Thickness: 0.8mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 01mm;
Min. Line Spacing: 0.09mm;
Surface Finishing: Enig;
Is_Customized: Yes;
Test: 100%;
Service: One-Stop;
Min. Track: 3/3mil;
Lead Time: 5-6days;
Soldermask: Red/ Blue/ Green/ Wihte/ Black;
Silkscreen: Red/ Blue/ Green/ Wihte/ Black;
Package: Vacuum+Carton;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: Hb, V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Structure: Multilayer Rigid PCB;
Production Process: Subtractive Process;
Board Material: Polyimide;
Copper Thickness: 1oz;
Board Thickness: 0.8mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 01mm;
Min. Line Spacing: 0.09mm;
Surface Finishing: Enig;
Is_Customized: Yes;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
MOQ: 1PCS;
Soldermask: White, Black, Blue, Red Ect;
Silkcreen: White, Black, Blue, Red Ect;
File: PCB File;
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