| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
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Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
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Metal Coating: Copper/ Tin/ Gold/Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Aluminum;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Processing Technology: Electrolytic Foil;
Other Service: ODM, OEM, Final Product Assembling;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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