| Specification |
Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin, Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thicknes: 1oz;
Solder Mask: Green;
Silk Screen: White;
PCB Type: PCB Board Assembly;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 10-15 Days;
Service: High Quality;
Layers: Customzied;
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Material: Fr4;
Board Thickness: 1.6mm;
Solder Mask: Green, Blue, Black, Red, White;
Surface Treatment: Enig;
Mini Hole: 0.1mm;
Mini Trace: 0.1mm;
Supply: Fast;
Service: One-Stop;
MOQ: 1 PCS;
Layers: Mutilayers;
Shipping Type: Shipping Type;
Payment: Paypal, Tt, Western Union;
File: PCB File;
Lead Time: ±0.10mm;
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Type: The Piston Pin, Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Standard Component: Standard Component;
Technics: SMT/DIP;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
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Type: The Piston Pin, Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Standard Component: Standard Component;
Technics: SMT/DIP;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Lead Time: 6-8 Working Days;
MOQ: 1PCS;
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