Multi-Layer HDI PCB Board and Circuit Board PCB Assembly with Blind and Buried in Shenzhen pictures & photos

Multi-Layer HDI PCB Board and Circuit Board PCB Assembly with Blind and Buried in Shenzhen

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Price

Min. Order Reference FOB Price

10 Pieces US$1.01-2.09 / Piece

Sepcifications

Metal Coating Aluminum
Layers Multilayer
Certification RoHS, CCC, ISO
Customized Customized
Condition New
Transport Package Packed with ESD Protection in Carton
Specification Thousands Choice Depends on Customers' requirement
Trademark JC
Origin China

Product Description

PRODUCT DESCRIPTION PCBA/PCB Assembly/Electronic Assembly/PCB Board/Circuit Board Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers Board thickness 0.1 to ...

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Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Main Products Industrial Wire Harness, Automatic Wire Harness, Medical Wire Harness, Electrical ...
Management System Certification Others
Product Certification UL
Address 7f Tianyou Second Industrial Zone, 28# Xintang Road, Xintian Community, Fuyong Town, Baoan District, 518103, P. R. China, Shenzhen, Guangdong, China
Main Markets North America, Europe, Australia, Domestic
Number of Foreign Trading Staff 3

PCB Comparison

	Multi-Layer HDI PCB Board and Circuit Board PCB Assembly with Blind and Buried in Shenzhen Contact Now	Specialized PCBA Production for Automotive Infotainment Systems with Printed Circuit Board Assembly Contact Now	Precision PCB Assembly PCBA for Medical Diagnostic Imaging Devices with HDI Technology Contact Now	Customized Circuit Board Design PCBA for Electric Vehicle Battery Management Systems with High-Quality Components Contact Now	Bespoke PCBA Fabrication for Aerospace Communication Transceivers with Multilayer PCB Technology Contact Now

Transaction Info
	Multi-Layer HDI PCB Board and Circuit Board PCB Assembly with Blind and Buried in Shenzhen Contact Now	Specialized PCBA Production for Automotive Infotainment Systems with Printed Circuit Board Assembly Contact Now	Precision PCB Assembly PCBA for Medical Diagnostic Imaging Devices with HDI Technology Contact Now	Customized Circuit Board Design PCBA for Electric Vehicle Battery Management Systems with High-Quality Components Contact Now	Bespoke PCBA Fabrication for Aerospace Communication Transceivers with Multilayer PCB Technology Contact Now
Price	US$1.01-2.09 / Piece	US$0.30-1.00 / Piece	US$0.50-2.00 / Piece	US$0.50-2.00 / Piece	US$0.50-2.00 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	RoHS, CCC, ISO	RoHS, ISO	RoHS, ISO	RoHS, ISO	RoHS, ISO
Management System Certification	Others	-	-	-	-
Trade Capacity
Export Markets	North America, Europe, Australia, Domestic	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Aluminum; Layers: Multilayer; Customized: Customized; Condition: New;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name	Shenzhen Jia Cheng Electric Co., Ltd.	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited
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