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      USB Charger Board
      US$1.50 / pieces
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      What is Factory Supply PCB Board PCBA Assembly USB Charger Board PCBA

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      10,000 pieces US$1.50 / pieces

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package Carton Box
      • Trademark FRANKEVER
      • Origin China
      • Keywords USB Charger Board
      • Product Name USB Charger PCB Board
      • Application for Charger Device

      Product Description

      Product Description We can help you customize different circuit boards for USB charger board depend on your requirements! 1. PCB/PCBA ODM &OEM Service 2.THREE SMT LInes, TWO DIP LINES and TWO Assembly Lines. 3. Five Engineers 4. ISO9001,RoHs,CE Layer count 1-18 ...

      Learn More

      USB Charger Board Comparison
      Transaction Info
      Price US$1.50 / pieces US$1.00-30.00 / Piece US$1.00-30.00 / Piece US$1.00-30.00 / Piece US$1.00-30.00 / Piece
      Min Order 10,000 pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T
      Quality Control
      Product Certification RoHS, ISO ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS. ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS RoHS, ISO
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: 1-3 months
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Keywords: USB Charger Board;
      Product Name: USB Charger PCB Board;
      Application: for Charger Device;
      Metal Coating: Gold;
      Mode of Production: SMT+DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
      PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
      Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
      Board Thickness: 0.2mm-8mm;
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Service: PCB/Componentssourcing/Assembly/Test/Package;
      PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
      Layer: 1-36 Layers;
      Max. PCB Size: 1900mm*600mm;
      Profiling Punching: Routing, V-Cut, Beveling;
      Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
      PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
      Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
      PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
      Metal Coating: Gold;
      Mode of Production: SMT+DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
      PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
      Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
      Board Thickness: 0.2mm-8mm;
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Service: PCB/Componentssourcing/Assembly/Test/Package;
      PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
      Layer: 1-36 Layers;
      Max. PCB Size: 1900mm*600mm;
      Profiling Punching: Routing, V-Cut, Beveling;
      Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
      PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
      Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
      PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
      Metal Coating: Gold;
      Mode of Production: SMT+DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
      PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
      Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
      Board Thickness: 0.2mm-8mm;
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Service: PCB/Componentssourcing/Assembly/Test/Package;
      PCBA Testing: Full Test Include Aoi, in-Circuit Test (Ict);
      Layer: 1-36 Layers;
      Max. PCB Size: 1900mm*600mm;
      Profiling Punching: Routing, V-Cut, Beveling;
      Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
      PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
      Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
      PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Small Order: Acceptable;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Material: Complex;
      Supplier Name

      Hangzhou FrankEver Imp. & Exp. Co., Ltd.

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

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