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      Minipc I5
      US$247.14-275.71 / Piece
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      What is Hystou Fanless Mini PC Low Power D4 Fanless RS232 Computer Desktop Minipc

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$247.14-275.71 / Piece

      Sepcifications

      • Application Field Industrial Control
      • Processor Type Intel
      • Stratification HardWare Layer
      • Range of Application General
      • Bus Type Not Bus Type
      • Certification CE, RoHS, FCC, Kc
      • Type Embedded Systems
      • Machine Word-Length 64
      • Instruction Type CISC
      • Kernel PIC
      • Transport Package Color Box
      • Specification PC size 238*182*52mm
      • Trademark HYSTOU
      • Origin Guangdong, China
      • Video Card Intel UHD Graphics 620
      • CPU I5-8250u
      • RAM 2*DDR4 So-DIMM Slots
      • USB 4*USB 3.0+4*USB 2.0
      • After-Sales Service Return and Replacement
      • LAN 2* RJ45 LAN

      Product Description

      Industrial Fanless Mini Box PC Compact Computer H4 Industrial Fanless Mini Box PC Compact Computer H4 Product Description Details Images Processor CPU Intel Core i5-8250U (6M Cache, 4 Cores 8 Threads, Base Frequency 1.60 GHz Turbo Frequency 3.40 GHz) Intel Core i7-8550U (8M Cache, 4 Cores ...

      Learn More

      Minipc I5 Comparison
      Transaction Info
      Price US$247.14-275.71 / Piece US$85.00-112.00 / Piece US$50.00-67.00 / Piece US$68.00-91.00 / Piece US$228.80-232.70 / Piece
      Min Order 1 Piece 2 Pieces 2 Pieces 2 Pieces 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, CREDIT CARD LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal
      Quality Control
      Product Certification CE, RoHS, FCC, Kc CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
      Management System Certification - - - - ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application Field: Industrial Control;
      Processor Type: Intel;
      Stratification: HardWare Layer;
      Range of Application: General;
      Bus Type: Not Bus Type;
      Type: Embedded Systems;
      Machine Word-Length: 64;
      Instruction Type: CISC;
      Kernel: PIC;
      Video Card: Intel UHD Graphics 620;
      CPU: I5-8250u;
      RAM: 2*DDR4 So-DIMM Slots;
      USB: 4*USB 3.0+4*USB 2.0;
      After-Sales Service: Return and Replacement;
      LAN: 2* RJ45 LAN;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som+ Carrier Board;
      Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
      OS: Android 13 Debian 11.6;
      GPU: Mali-G610 MP4, 450 Gflops;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som+ Carrier Board;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      GPU: Arm Mali-G52 Mc3;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Type: Embedded Systems;
      Processor: RK3562J/RK3562;
      RAM: 1/2/4GByte LPDDR4X;
      ROM: 8/16/32GByte eMMC;
      Ethernet Port: 1 to 3 ports, 3x10/100M;
      Antenna: 2x, used for 4G/WIFI/GPS, and other modules;
      Core: 4x ARM Cortex-A53 (64-bit) +1xM0;
      Digital Input: YES;
      Digital Output: YES;
      RK3562 clock speed: 2.0GHz;
      Analog Input: YES;
      Analog Output: YES;
      USB: 2xUSB 2.0 HOST;
      NPU: 1TOPS;
      SIM Slot: 1, NANO;
      Debug: 1x Micro USB debugging port.;
      Supplier Name

      Shenzhen Anstou Technology LTD

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Beilai Technology Co., Ltd.

      Gold Member Audited Supplier

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