Mini PC

US$191.64-221.40 / units

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What is Hystou New Design Fanless Industrial Dual LAN Inter Core I3 10th Gen Mini PC DDR4 Dust-Proof Desktop Micro Computer

Name: Hystou New Design Fanless Industrial Dual LAN Inter Core I3 10th Gen Mini PC DDR4 Dust-Proof Desktop Micro Computer
Uploaded: 2025-12-23T14:08:19+08:00
Description: Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. U

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Price

Purchase Qty. Reference FOB Price

1-9 units US$221.40

10-99 units US$206.27

100+ units US$191.64

Sepcifications

Application Field Industrial Control
Processor Type Intel
Stratification HardWare Layer
Range of Application General
Certification CE, RoHS, FCC
Type Embedded Systems
Machine Word-Length 8
Instruction Type RISC
Transport Package Standard Color Express Box
Specification PC size 205*125*53mm Package size 308*206*75mm
Trademark HYSTOU
Origin Guangdong, China
CPU Intel Core I3-10110u
GPU Intel UHD Graphics
Hard Drive Type SSD+HDD
RAM Type DDR4
LAN 2*RJ45 LAN
USB Port 2*USB 2.0 Port, 4*USB 3.0 Port
OS Windows 10/11, Linux
Plugs Type Us, Jp, Cn, Au, UK, EU
Use Industrial
Graphics Card Chipset Integrated Card
Material Aluminum Alloy
Video Memory 2 GB
Warranty(Year) 3-Year
Weight Net 1.2kg; Gross 1.9kg

Product Description

Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. USB3.0 transmission speed is fast, which improves your work efficiency and saves your time. It ...

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Shenzhen Fannis Technology Co., Ltd

Diamond Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(7 Reviews)

Main Products Mini PC, Fanless Computer, Industrial PC, All in One PC, Touch Screen Industrial Panel PC, ...
Address 10th Floor, Building a, Sanhuan Technology Building, No. 1, Dongchang Road and Tongren Road, Guangming District, Shenzhen City, Guangdong Province, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CIF, DDP, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union, Money Gram, Visa Card
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Mini PC Comparison

	Hystou New Design Fanless Industrial Dual LAN Inter Core I3 10th Gen Mini PC DDR4 Dust-Proof Desktop Micro Computer Contact Now	Mekotronics 125h-SDI 4K Mini PC Input HDMI Blackmagic Design Decklink 16+512g Contact Now	Quick View T113-i Edge IoT Device with 4DO 2RTD 4-Wire PT100 12DI RS485 for Self-service Terminal Contact Now	Quick View 2ARM Cortex-A7 2DI 2DO Industrial Grade Edge Computing Gateway Device for Automatic Test System Contact Now	Quick View Customizable ROM and RAM Options IoT 4G Gateway with 3RS485 CAN 4DI 4DO for Smart Logistics Contact Now

Transaction Info
	Hystou New Design Fanless Industrial Dual LAN Inter Core I3 10th Gen Mini PC DDR4 Dust-Proof Desktop Micro Computer Contact Now	Mekotronics 125h-SDI 4K Mini PC Input HDMI Blackmagic Design Decklink 16+512g Contact Now	Quick View T113-i Edge IoT Device with 4DO 2RTD 4-Wire PT100 12DI RS485 for Self-service Terminal Contact Now	Quick View 2ARM Cortex-A7 2DI 2DO Industrial Grade Edge Computing Gateway Device for Automatic Test System Contact Now	Quick View Customizable ROM and RAM Options IoT 4G Gateway with 3RS485 CAN 4DI 4DO for Smart Logistics Contact Now
Price	US$191.64-221.40 / units	US$785.00 / Piece	US$173.00-186.00 / Piece	US$164.00-177.00 / Piece	US$176.00-189.00 / Piece
Min Order	1 units	10 Pieces	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union, Money Gram, Visa Card	T/T, PayPal	T/T, PayPal	T/T, PayPal	T/T, PayPal
Quality Control
Product Certification	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC
Management System Certification	-	-	ISO9001:2015	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM	-	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Application Field: Industrial Control; Processor Type: Intel; Stratification: HardWare Layer; Range of Application: General; Type: Embedded Systems; Machine Word-Length: 8; Instruction Type: RISC; CPU: Intel Core I3-10110u; GPU: Intel UHD Graphics; Hard Drive Type: SSD+HDD; RAM Type: DDR4; LAN: 2RJ45 LAN;* USB Port: 2USB 2.0 Port, 4USB 3.0 Port; OS: Windows 10/11, Linux; Plugs Type: Us, Jp, Cn, Au, UK, EU; Use: Industrial; Graphics Card Chipset: Integrated Card; Material: Aluminum Alloy; Video Memory: 2 GB; Warranty(Year): 3-Year; Weight: Net 1.2kg; Gross 1.9kg;	Application Field: Industrial Control; Processor Type: Intel; Type: Intel X86 PC; Chipset: Intel Core Ultra 5 125h; CPU: 14 Cores 4.5GHz, 3.6GHz 2.5GHz; GPU: Intel Arc Graphics 2.2GHz; Npu: Intel Deep Learning Enchancement; Video Output: HDMI Output X2; Video Input 01: HDMI Input, Blackmagic Design Decklink; Video Input 02: SDI Input, Blackmagic Design Decklink;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Type: Embedded Systems; Processor: T113-i 1.2GHz; RAM: 128M/256M/512M/1GByte DDR3; ROM: 256Mbyte Nand Flash or 4/8GByte eMMC; Input Voltage: DC 9~36V; Ethernet Port: RJ-45 1x100M; Mini PCIE: Supports Bluetooth, WiFi, 4G module; Digital Input: YES; Digital Output: YES; USB Port: 2x USB2.0 ESD Level 3; GPIO: YES; CAN: YES; SIM Slot: 1 slot, NANO; Installation: DIN35 rail mounting, wall mounting; Antenna: 2, For 4G/WIFI/GPS; IO Slot: X and Y series IO board;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Type: Embedded Systems; Processor: T113-i 1.2GHz; RAM: 128M/256M/512M/1GByte DDR3; ROM: 256Mbyte Nand Flash or 4/8GByte eMMC; Input Voltage: DC 9~36V; Ethernet Port: RJ-45 2x100M; Mini PCIE: Supports Bluetooth, WiFi, 4G module; Digital Input: YES; Digital Output: YES; USB Port: 2x USB2.0 ESD Level 3; GPIO: YES; CAN: YES; SIM Slot: 1 slot, NANO; Installation: DIN35 rail mounting, wall mounting; Antenna: 2, For 4G/WIFI/GPS; IO Slot: X and Y series IO board;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Type: Embedded Systems; Processor: T113-i 1.2GHz; RAM: 128M/256M/512M/1GByte DDR3; ROM: 256Mbyte Nand Flash or 4/8GByte eMMC; Input Voltage: DC 9~36V; Ethernet Port: RJ-45 2x100M; Mini PCIE: Supports Bluetooth, WiFi, 4G module; Digital Input: YES; Digital Output: YES; USB Port: 2x USB2.0 ESD Level 3; GPIO: YES; CAN: YES; SIM Slot: 1 slot, NANO; Installation: DIN35 rail mounting, wall mounting; Antenna: 2, For 4G/WIFI/GPS; Debug: 1x Micro USB debug port;
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