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      Mini PC
      US$197.15-227.81 / units
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 units US$227.81

      10-99 units US$212.54

      100+ units US$197.15

      Sepcifications

      • Application Field Industrial Control
      • Processor Type Intel
      • Stratification HardWare Layer
      • Range of Application General
      • Certification CE, RoHS, FCC
      • Type Embedded Systems
      • Machine Word-Length 8
      • Instruction Type RISC
      • Transport Package Standard Color Express Box
      • Specification PC size 205*125*53mm Package size 308*206*75mm
      • Trademark HYSTOU
      • Origin Guangdong, China
      • CPU Intel Core I3-10110u
      • GPU Intel UHD Graphics
      • Hard Drive Type SSD+HDD
      • RAM Type DDR4
      • LAN 2*RJ45 LAN
      • USB Port 2*USB 2.0 Port, 4*USB 3.0 Port
      • OS Windows 10/11, Linux
      • Use Industrial
      • Plugs Type Us, Jp, Cn, Au, UK, EU
      • Material Aluminum Alloy
      • Graphics Card Chipset Integrated Card
      • Video Memory 2 GB
      • Warranty(Year) 3-Year
      • Weight Net 1.2kg; Gross 1.9kg

      Product Description

      Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. USB3.0 transmission speed is fast, which improves your work efficiency and saves your time. It ...

      Learn More

      Mini PC Comparison
      Transaction Info
      Price US$197.15-227.81 / units US$228.80-232.70 / Piece US$50.00-67.00 / Piece US$50.00-67.00 / Piece US$89.00-129.00 / Piece
      Min Order 1 units 1 Piece 2 Pieces 2 Pieces 2 Pieces
      Payment Terms LC, T/T, PayPal, Western Union, Money Gram, Visa Card T/T, PayPal LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
      Management System Certification - ISO9001:2015 - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model ODM Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application Field: Industrial Control;
      Processor Type: Intel;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: Embedded Systems;
      Machine Word-Length: 8;
      Instruction Type: RISC;
      CPU: Intel Core I3-10110u;
      GPU: Intel UHD Graphics;
      Hard Drive Type: SSD+HDD;
      RAM Type: DDR4;
      LAN: 2*RJ45 LAN;
      USB Port: 2*USB 2.0 Port, 4*USB 3.0 Port;
      OS: Windows 10/11, Linux;
      Use: Industrial;
      Plugs Type: Us, Jp, Cn, Au, UK, EU;
      Material: Aluminum Alloy;
      Graphics Card Chipset: Integrated Card;
      Video Memory: 2 GB;
      Warranty(Year): 3-Year;
      Weight: Net 1.2kg; Gross 1.9kg;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Type: Embedded Systems;
      Processor: RK3562J/RK3562;
      RAM: 1/2/4GByte LPDDR4X;
      ROM: 8/16/32GByte eMMC;
      Ethernet Port: 1 to 3 ports, 3x10/100M;
      Antenna: 2x, used for 4G/WIFI/GPS, and other modules;
      Core: 4x ARM Cortex-A53 (64-bit) +1xM0;
      Digital Input: YES;
      Digital Output: YES;
      RK3562 clock speed: 2.0GHz;
      Analog Input: YES;
      Analog Output: YES;
      USB: 2xUSB 2.0 HOST;
      NPU: 1TOPS;
      SIM Slot: 1, NANO;
      Debug: 1x Micro USB debugging port.;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Supplier Name

      Shenzhen Fannis Technology Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Beilai Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

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