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      PCBA
      US$0.32-7.00 / Piece

      15 Years PCBA Factory SMT DIP & Electronic Components Assembly Open Bom Quick Quote Video

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-99 Pieces US$7.00

      100-999 Pieces US$2.50

      1,000-2,999 Pieces US$0.80

      3,000+ Pieces US$0.32

      Sepcifications

      • Type Customized
      • Dielectric FR-4
      • Material Aluminum Covered Copper Foil Layer
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Customized
      • Processing Technology Customized
      • Base Material Aluminum
      • Insulation Materials Organic Resin
      • Brand OEM/ODM
      • Transport Package Antistatic Package+Plastic Box and Carton Box
      • Specification Customized
      • Trademark Customized
      • Origin Shenzhen China
      • PCBA-Testing X-ray, Aoi
      • Processing Electrolytic Foil
      • SMT Capacity >2 Million Points/Day
      • DIP Capacity >100K Parts/Day
      • Certification RoHS, CCC, ISO
      • Min. Space of BGA +/- 0.3mm
      • Min.Pin Space of IC 0.3mm
      • Max.Precision of IC Assembly 0.03mm
      • Surface Finishing Lead-Free HASL
      • Number of Layers 4-10 Layer
      • Board Thickness 1.6mm

      Product Description

      15 Years PCBA Factory SMT DIP &Electronic Components Assembly Open BOM Quick Quote Specification PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, FR-4 High ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$0.32-7.00 / Piece US$0.10-2.90 / Piece US$0.60-7.00 / Piece US$0.10-0.50 / Piece US$0.24-4.30 / Piece
      Min Order 10 Pieces 2 Pieces 2 Pieces 1 Piece 1 Piece
      Payment Terms T/T T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
      Quality Control
      Product Certification RoHS, CCC, ISO - - - -
      Management System Certification ISO9001:2015 - - - -
      Trade Capacity
      Export Markets Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Customized;
      Processing Technology: Customized;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Soldermask Color: Green, Yellow, Blue, Black, White...;
      Sample: Available;
      OEM/ODM: Available;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Color of Silk Screen: Green, Purple, Black;
      Service: OEM / Dfm;
      Type: Flexible Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Supplier Name

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

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