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      PCBA Assembly
      US$1.60 / Piece

      Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture Video

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      10 Pieces US$1.60 / Piece

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, CCC, ISO
      • Customized Customized
      • Condition Used
      • Transport Package Pallets
      • Specification 600*600
      • Trademark OEM ODM
      • Origin China
      • Product Name OEM Reverse PCBA Engineering for Mobile Phone
      • Shipment Way by Air by Sea
      • Payment Way Tt
      • Min.Pin Space of IC 0.3mm
      • Min. Space of BGA +/- 0.3mm
      • Max.Precision of IC Assembly 0.03mm
      • SMT Capacity >2 Million Points/Day
      • DIP Capacity >100K Parts/Day
      • Electronic 100kmonth
      • Test  100% Aoi Testing

      Product Description

      OEM reverse PCBA engineering for mobile phone circuit board assembly manufacture Company Profile Shenzhen Hongzhou Smart Technology Co.,Ltd is a factory offering EMS (Electronic Manufacturing service) manufacturing.The main business of our factory is as below: 1. High Quality PCBA OEM &ODM ...

      Learn More

      PCBA Assembly Comparison
      Transaction Info
      Price US$1.60 / Piece US$0.10-5.00 / Piece US$0.90-3.90 / Piece US$0.90-3.90 / Piece US$0.90-3.90 / Piece
      Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T - LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification RoHS, CCC, ISO RoHS, CCC, ISO, UL Reach RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
      Management System Certification ISO9001:2015 - - - -
      Trade Capacity
      Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: 3-6 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      Product Name: OEM Reverse PCBA Engineering for Mobile Phone;
      Shipment Way: by Air by Sea;
      Payment Way: Tt;
      Min.Pin Space of IC: 0.3mm;
      Min. Space of BGA: +/- 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Electronic: 100kmonth;
      Test&#160;: 100% Aoi Testing;
      Metal Coating: Copper;
      Mode of Production: DIP SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Quality Test: Aoi, 100% E-Test;
      V- Cut Tolerance: +-10mi;
      Bevel Edge: +-5mil;
      Hole Location Tolerance: +-2mil;
      Hole Diameter Tolerance: +-0.05mm;
      Board Thickness Tolerance: +-5%;
      Line Width/Space Tolerance: +-10%;
      Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
      Mode of Production: SMT and DIP;
      Layers: Multilayer;
      Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
      Customized: Customized;
      Condition: New;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing,Flying Probe Tester,Functional;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
      Mode of Production: SMT and DIP;
      Layers: Multilayer;
      Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
      Customized: Customized;
      Condition: New;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing, Functional Testing;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
      Mode of Production: SMT and DIP;
      Layers: Multilayer;
      Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
      Customized: Customized;
      Condition: New;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing,Flying Probe Tester,Functional;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Supplier Name

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Ps Electronics Co., Ltd

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

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